Onpress Printed Circuits Limited
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Multi-Layers
- Board Thickness after Pressing
- Warp
- Min. line width
- Min. spacing
- Line width and spacing tolerance
- Min. annular ring
- Min. clearance
- Min. thermal gap
- Inner registration
Gold Board
- Hole size tolerance
- Hole location tolerance
- Minimum hole size
- Line width tolerance
- Line space tolerance
- Min. Bonding lead width...
Hot Air Leveling
- Hole size tolerance
- Hole location tolerance
- Minimum hole size
- Line width tolerance
- Line space tolerance
- Minimum line width...
